Binghamton University will officially open its Center for Advanced Microelectronics Manufacturing (CAMM) facility at 11 a.m. Monday, March 31, at Endicott Interconnect Technologies, Building 258, Oak Hill Avenue, Endicott.

A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
The CAMM is an integral component of Binghamton University’s New York State Center of Excellence in Small Scale Systems Integration and Packaging. As one of New York State's most innovative initiatives, the Centers of Excellence (COE) support high technology ventures through a collaborative approach among the State, academia, private venture capital companies, and other private and public sector parties. As one of only six COE’s in New York, Binghamton University’s Center specializes in small-scale systems design, process development, prototyping, and manufacturing for academia and the microelectronics industry.
After brief remarks by a selection of government, academic and industry partners, Binghamton University President Lois B. DeFleur will join Congressman Maurice Hinchey (D – NY) and Michael Cieskinski, President and CEO, United States Display Consortium, in unveiling a new CAMM sign that will be displayed in the facility. Tours of the CAMM facility will follow.